Speeding Up Failure Analysis Using Fab and Design Data

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Technical article| November 01 2017

Rao Desineni;

Rao Desineni

GLOBALFOUNDRIES

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Yan Pan

GLOBALFOUNDRIES

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EDFA Technical Articles (2017) 19 (4): 62–63.

https://doi.org/10.31399/asm.edfa.2017-4.p062

Abstract

This column discusses the benefits of using IC design and wafer-processing test data for failure analysis.

2017

ASM International

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