Thinning and Polishing Highly Warped Die: Part II; A Discussion of the Mechanical Limitations of Flattening a Curved Die in Preparation for Die Thinning

This is the second article in a two-part series on how to properly thin curved and highly warped die. Part I, published in the August 2015 issue of EDFA, introduces the concept of contour machining, a CNC technique driven by thickness measurement data, and describes a multistep grinding and lapping process along with the results. Part II covers the mechanical, physical, and mounting variables associated with thinning and polishing, giving particular attention to mounting procedures and their effect on surface profiles and thickness variations.