Electromigration is a wearout mechanism that contributes significantly to IC failures. This article discusses the causes and effects of this often overlooked failure mode and presents practical guidelines to help analysts determine whether or not electromigration is the cause of a particular failure. It also discusses the differences between aluminum and copper electromigration.

aluminum electromigration, copper electromigration, electromigration, metal transfer
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2014
ASM International
Topics
Semiconductor wafer fabrication Electrochemical metal migration
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