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ASM Handbook

Welding, Brazing and Soldering

Edited by
David LeRoy Olson
David LeRoy Olson
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Thomas A. Siewert
Thomas A. Siewert
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Stephen Liu
Stephen Liu
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Glen R. Edwards
Glen R. Edwards
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ASM International
Volume
6
ISBN electronic:
978-1-62708-173-3
Publication date:
1993
Book Chapter

Fundamentals of Soldering

By
Mel M. Schwartz
Mel M. Schwartz
Sikorsky Aircraft
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Published:
1993
Page range:
126 - 137

Abstract

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.

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Mel M. Schwartz, 1993. "Fundamentals of Soldering", Welding, Brazing and Soldering, David LeRoy Olson, Thomas A. Siewert, Stephen Liu, Glen R. Edwards

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