Skip to Main Content
ASM Handbook

Welding, Brazing and Soldering

Edited by
David LeRoy Olson
David LeRoy Olson
Search for other works by this author on:
Thomas A. Siewert
Thomas A. Siewert
Search for other works by this author on:
Stephen Liu
Stephen Liu
Search for other works by this author on:
Glen R. Edwards
Glen R. Edwards
Search for other works by this author on:
ASM International
Volume
6
ISBN electronic:
978-1-62708-173-3
Publication date:
1993
Book Chapter

Furnace and Infrared Soldering

By
Phil Zarrow
Phil Zarrow
Synergistek Associates
Search for other works by this author on:
Published:
1993
Page range:
353 - 355

Abstract

Furnace soldering (FS) encompasses a group of reflow soldering techniques in which the parts to be joined and preplaced filler metal are put in a furnace and then heated to the soldering temperature. This article describes three reflow soldering techniques in surface-mount technology, namely, vapor-phase reflow, area conduction, and infrared heating. These three techniques are considered as mass reflow techniques, because all of the solderable interconnections on the surface of a printed wiring board (PWB) assembly are brought through the reflow heating cycle simultaneously. The article explains four regions of reflow profile, namely, preheat (prebake), preflow (soak), reflow, and cooldown. It concludes with a description on the bare copper assembly process, which is carried out in the inert atmosphere.

You do not currently have access to this content.
Don't already have an account? Register

Phil Zarrow, 1993. "Furnace and Infrared Soldering", Welding, Brazing and Soldering, David LeRoy Olson, Thomas A. Siewert, Stephen Liu, Glen R. Edwards

Download citation file:


×
Close Modal
This Feature Is Available To Subscribers Only

Sign In or Create an Account

Close Modal
Close Modal