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ASM Handbook

Fatigue and Fracture

By
ASM Handbook Committee
ASM Handbook Committee
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ASM International
Volume
19
ISBN electronic:
978-1-62708-193-1
Publication date:
1996
Book Chapter

Fatigue of Solders and Electronic Materials

By
Aleksander Zubelewicz
Aleksander Zubelewicz
IBM
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Semyon Vaynman
Semyon Vaynman
Northwestern University
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Srinivas T. Rao
Srinivas T. Rao
Solectron
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Published:
1996
Page range:
882 - 891

Abstract

This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.

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Aleksander Zubelewicz, Semyon Vaynman, Srinivas T. Rao, 1996. "Fatigue of Solders and Electronic Materials", Fatigue and Fracture, ASM Handbook Committee

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