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ASM Handbook

Failure Analysis and Prevention

Edited by
William T. Becker
William T. Becker
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Roch J. Shipley
Roch J. Shipley
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ASM International
Volume
11
ISBN electronic:
978-1-62708-180-1
Publication date:
2002
Book Chapter

X-Ray Diffraction Residual Stress Measurement in Failure Analysis

By
J.A. Pineault
J.A. Pineault
Proto Manufacturing Ltd.
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M. Belassel
M. Belassel
Proto Manufacturing Ltd.
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M.E. Brauss
M.E. Brauss
Proto Manufacturing Ltd.
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Published:
2002
Page range:
484 - 497
Publication history
November 01, 2002

Abstract

This article focuses primarily on what an analyst should know about applying X-ray diffraction (XRD) residual stress measurement techniques to failure analysis. Discussions are extended to the description of ways in which XRD can be applied to the characterization of residual stresses in a component or assembly. The article describes the steps required to calibrate instrumentation and to validate stress measurement results. It presents a practical approach to sample selection and specimen preparation, measurement location selection, and measurement depth selection, as well as an outline on measurement validation. The article also provides information on stress-corrosion cracking and corrosion fatigue. The importance of residual stress in fatigue is described with examples. The article explains the effects of heat treatment and manufacturing processes on residual stress. It concludes with a section on the XRD stress measurements in multiphase materials and composites and in locations of stress concentration.

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J.A. Pineault, M. Belassel, M.E. Brauss, 2002. "X-Ray Diffraction Residual Stress Measurement in Failure Analysis", Failure Analysis and Prevention, William T. Becker, Roch J. Shipley

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