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ASM Handbook

Corrosion: Environments and Industries

Edited by
Stephen D. Cramer
Stephen D. Cramer
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Bernard S. Covino, Jr.
Bernard S. Covino, Jr.
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ASM International
Volume
13C
ISBN electronic:
978-1-62708-184-9
Publication date:
2006
Book Chapter

Corrosion and Related Phenomena in Portable Electronic Assemblies

By
Puligandla Viswanadham
Puligandla Viswanadham
Nokia Research Center
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Sridhar Canumalla
Sridhar Canumalla
Nokia Enterprise Systems
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Published:
2006
Page range:
643 - 651
Publication history
October 12, 2006

Abstract

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

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Puligandla Viswanadham, Sridhar Canumalla, 2006. "Corrosion and Related Phenomena in Portable Electronic Assemblies", Corrosion: Environments and Industries, Stephen D. Cramer, Bernard S. Covino, Jr.

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