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ASM Handbook

Corrosion: Environments and Industries

Edited by
Stephen D. Cramer
Stephen D. Cramer
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Bernard S. Covino, Jr.
Bernard S. Covino, Jr.
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ASM International
Volume
13C
ISBN electronic:
978-1-62708-184-9
Publication date:
2006
Book Chapter

Corrosion in the Assembly of Semiconductor Integrated Circuits

By
A.C. Tan
A.C. Tan
Micron Semiconductor Asia
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Published:
2006
Page range:
629 - 633
Publication history
October 09, 2006

Abstract

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

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A.C. Tan, 2006. "Corrosion in the Assembly of Semiconductor Integrated Circuits", Corrosion: Environments and Industries, Stephen D. Cramer, Bernard S. Covino, Jr.

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