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ASM Handbook

Corrosion: Environments and Industries

Edited by
S.D. Cramer
S.D. Cramer
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B.S. Covino, Jr.
B.S. Covino, Jr.
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ASM International
Volume
13C
ISBN electronic:
978-1-62708-184-9
Publication date:
2006
Book Chapter

Corrosion in Microelectronics

By
Jianhai Qiu
Jianhai Qiu
Nanyang Technological University
,
Singapore
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Published:
2006
Page range:
613 - 622
Publication history
October 03, 2006

Abstract

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

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Jianhai Qiu, 2006. "Corrosion in Microelectronics", Corrosion: Environments and Industries, S.D. Cramer, B.S. Covino, Jr.

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