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ASM Handbook

Corrosion: Environments and Industries

Edited by
Stephen D. Cramer
Stephen D. Cramer
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Bernard S. Covino, Jr.
Bernard S. Covino, Jr.
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ASM International
Volume
13C
ISBN electronic:
978-1-62708-184-9
Publication date:
2006
Book Chapter

Corrosion in the Microelectronics Industry

Published:
2006

Abstract

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

Abstract

This article presents a detailed examination of corrosion at the various production stages of wafer fabrication. The corrosion issues related to batch metal-etch systems and single-wafer metal-etch systems are also discussed. The article provides a case study, which illustrates that the factors outside the normal processing of wafers or tool-specific problems can contribute to metal-line corrosion.

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2006. "Corrosion in the Microelectronics Industry", Corrosion: Environments and Industries, Stephen D. Cramer, Bernard S. Covino, Jr.

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