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ASM Handbook

Surface Engineering

Edited by
C.M. Cotell
C.M. Cotell
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J.A. Sprague
J.A. Sprague
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F.A. Smidt, Jr.
F.A. Smidt, Jr.
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ASM International
Volume
5
ISBN electronic:
978-1-62708-170-2
Publication date:
1994
Book Chapter

Plasma-Enhanced Chemical Vapor Deposition

By
Prabha K. Tedrow
Prabha K. Tedrow
Consultant
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Rafael Reif
Rafael Reif
Massachusetts Institute of Technology
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Published:
1994
Page range:
532 - 537

Abstract

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

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Prabha K. Tedrow, Rafael Reif, 1994. "Plasma-Enhanced Chemical Vapor Deposition", Surface Engineering, C.M. Cotell, J.A. Sprague, F.A. Smidt, Jr.

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