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ASM Handbook

Surface Engineering

Edited by
C.M. Cotell
C.M. Cotell
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J.A. Sprague
J.A. Sprague
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F.A. Smidt, Jr.
F.A. Smidt, Jr.
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ASM International
Volume
5
ISBN electronic:
978-1-62708-170-2
Publication date:
1994
Book Chapter

Chemical Vapor Deposition of Nonsemiconductor Materials

By
Hugh O. Pierson
Hugh O. Pierson
Consultant
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Published:
1994
Page range:
510 - 516

Abstract

This article presents the principles of chemical vapor deposition (CVD) with illustrations. It discusses the types of CVD processes, namely, thermal CVD, plasma CVD, laser CVD, closed-reactor CVD, chemical vapor infiltration, and metal-organic CVD. The article reviews the CVD reactions of materials related to hard, tribological, and high-temperature coatings and to free-standing structures. It concludes by reviewing the advantages, disadvantages, and applications of CVD.

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Hugh O. Pierson, 1994. "Chemical Vapor Deposition of Nonsemiconductor Materials", Surface Engineering, C.M. Cotell, J.A. Sprague, F.A. Smidt, Jr.

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