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Semiconductor wafer fabrication
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Journal Articles
AM&P Technical Articles (2022) 180 (3): 49–53.
Published: 01 April 2022
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Ni-ion irradiated NiTi is nearly 50% harder, retains 85% recoverable deformation, and has reduced hysteresis. This work explores the feasibility of using ion beam modification to modulate the austenite to martensite phase transformation in NiTi, thereby achieving novel or localized properties in near-surface regions.
Journal Articles
AM&P Technical Articles (2018) 176 (8): 42–45.
Published: 01 November 2018
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The Australian Research Council is funding a new training center in Surface Engineering for Advanced Materials (SEAM) based in Melbourne, Australia. This article describes the research, development, and educational objectives of the new center, which aims to solve crucial surface engineering problems, such as their design, fabrication, testing, analysis, and pathways towards value-added applications.
Journal Articles
AM&P Technical Articles (2014) 172 (10): 25–27.
Published: 01 October 2014
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Physical cross-sectioning is commonly used on parts to reveal and study their internal features and defects. An alternative technology, acoustic cross-sectioning, produces equivalent results and images for small parts without damaging them. This article describes a new system for acoustic cross-sectioning and presents a case study of its use in integrated circuit analysis.
Journal Articles
AM&P Technical Articles (2014) 172 (10): 20–22.
Published: 01 October 2014
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To meet the rigorous demands of next-generation computer technology, new approaches to nondestructive measurement for early stage, temperature dependent materials characterization are needed. Terahertz spectroscopy bypasses the limitations of other characterization techniques by enabling nondestructive measurement under variable temperature and high magnetic field conditions.
Journal Articles
AM&P Technical Articles (2014) 172 (8): 23–25.
Published: 01 August 2014
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As today's electronics systems continue to shrink and become more complex and pervasive, failures can cause costly downtime, product delays and recalls, and debilitating reputational damage. Finding and fixing failures before they do damage is important, but becomes increasingly challenging when devices are built using ever more complex designs. The solution is to employ a comprehensive, multidisciplinary approach to electronic system failure analysis. In addition, many failures can be avoided altogether by thorough testing, coupled with the latest focused ion beam circuit edit techniques. These advanced methods quickly and inexpensively debug and validate design fixes or explore design optimization opportunities in integrated circuits without having to commit to costly and time-consuming full mask spins.
Journal Articles
AM&P Technical Articles (2013) 171 (7): 22–26.
Published: 01 July 2013
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This article provides an overview of pulsed laser dewetting self-assembly (PLDSA) and its use in the production of silver and cobalt films with desired nanostructure.