Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Journal
Article Type
Date
Availability
1-2 of 2
Diffusion bonding
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
AM&P Technical Articles (2023) 181 (4): 14–18.
Published: 01 May 2023
Abstract
View article
PDF
Enhancement of the diffusion bonding process for the development of compact heat exchangers (CHXs) provides an energy efficient solution for high-temperature applications in advanced nuclear reactors and other technologies. However, available information is limited concerning the diffusion bonding (and manufacturing) of CHXs in high temperature applications and associated selection of bonded materials, bonding conditions, mechanical performance, and thermo-fluid characteristics. This article reviews the available knowledge and the ongoing research being conducted to address gaps in information and application.
Journal Articles
AM&P Technical Articles (2016) 174 (1): 22–25.
Published: 01 January 2016
Abstract
View article
PDF
Advancements in nanoscience are making it possible to metallically glue two solids together at room temperature, in air, and under a small amount of mechanical pressure. Metallic glues can serve as excellent conductors for heat dissipation and electrical current in electronic devices and also as leak-resistant seals for vacuum environments.