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Alloy Digest (1990) 39 (11): P-20.
Published: 01 November 1990
.... Producer or Source: The Dow Chemical Company, Dow Plastics Copyright © ASM International® 1996 1996 ASM International 9450P PLATEABLE GRADE chemical composition elasticity fracture toughness hardness physical properties tensile properties 945Op PLATEABLE GRADE E%Ye P-20 - DIGEST...
Alloy Digest (1977) 26 (10): Cu-341.
Published: 01 October 1977
... CHASE 14310 is a high-conductivity copper with excellent resistance to thermal softening. It is a deoxidized, electronic grade of copper with excellent formability, weldability and plateability. It is available in strip form and has a wide range of applications. This datasheet provides information...
Alloy Digest (2016) 65 (11): Cu-853.
Published: 01 November 2016
... 400 °C (752 °F), and higher than C14415 Good bare bondability Good stamping formability and etching formability Good solderability and plateability. Protrusions may be reduced by silver plating. Product Forms Available: Strip Applications: Leadframe for transistor, leadframe for LED, heat sink...
Alloy Digest (2016) 65 (12): Cu-854.
Published: 01 December 2016
...), polybrominated biphenyl (PBB), polybrominated biphenyl ether (PBDE); restricted with RoHS, etc. Good solderability and plateability. Can achieve higher silver plating reflection required for lead frames of high-luminosity LEDs. Product Forms Available: Strip Applications: Leadframe for QFP, QFN package...
Alloy Digest (2019) 68 (4): Cu-886.
Published: 01 April 2019
... system developed jointly by Olin Brass and Wieland-Werke. This alloy provides engineers a unique combination of properties. It incorporates very high electrical and thermal conductivity, excellent formability, good plateability, and is used in under-hood automotive connectors to smart grid power...
Alloy Digest (2004) 53 (10): Cu-726.
Published: 01 October 2004
... developed jointly by Olin Brass and Wieland-Werke of Germany (where it is known as K88). Alloy C18080 provides design engineers with a combina- tion of properties with very high electrical and thermal conduc- tivity, good strength, excellent formability, good plateability, and extremely high resistance to...
Alloy Digest (1999) 48 (4): Cu-632.
Published: 01 April 1999
... that require soldering. Plateability: Olin C151 can be readily plated with a variety of pure and al- loyed metals using either hot dip or electrolytic methods. Specification Equivalents: UNS C15100 ASTM B 422 General Characteristics: Olin C151 is a dilute alloy of copper and zirconium (0.1% Zr, balance...
Alloy Digest (1993) 42 (9): Cu-588.
Published: 01 September 1993
... excellent cor- rosion resistance. This combination provides designers with new possibilities for high-performance miniaturized sockets, connectors, springs and other precision-stamped parts in electronics applications. Excellent plateability, solderability, corrosion resistance and nearly constant...
Alloy Digest (1993) 42 (11): Cu-592.
Published: 01 November 1993
...% under an initial surface stress of 10.9 ksi (75 MPa) to 9.5% under an initial surface stress of 71 ksi (489 MPa). Solderability and Plateability: C76200 has good solderability and can be joined readily with lead-tin solders using conventional activate resin fluxes. The minimal non-refractory oxide film...
Alloy Digest (1999) 48 (1): Cu-627.
Published: 01 January 1999
...: C197 exhibits excellent solderability and plateability due to the benign nature of its oxides. The oxides on C197 are easily cleaned, leaving the surface readily fluxed and wetted by solders and brazing alloys. C197 solderability is equal to that of C110, C194, and C510 phosphor bronze. C197 has...