Indalloy 227 is a lead-free solder developed to replace common tin-lead eutectic solder used in electronics soldering applications. Comparisons are given in this data sheet between Indalloy 227 and 63Sn37Pb, the composition of the alloy that Indalloy 227 was designed to replace. This datasheet provides information on composition, physical properties, elasticity, tensile properties, and shear strength as well as creep and fatigue. It also includes information on joining. Filing Code: SN-13. Producer or source: Indium Corporation of America.

chemical composition, creep properties, elasticity, electronics soldering applications, fatigue properties, INDALLOY 227, joinability, physical properties, shear strength, tensile properties, thermal properties
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Copyright © ASM International® 1998
1998
ASM International
Topics
Electrical and electronics Solders and solder alloys Chemical composition Joinability Creep properties Elastic modulus Fatigue properties Shear strength Tensile properties Physical properties Thermal properties
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