Abstract

INDALLOY No. 7 is a solder (50% indium-50% lead) that drastically reduces gold scavenging when used to solder components to gold-coated substrates in place of conventional (63% tin-37% lead) solder. Thus it has had obvious applications in the hybrid microelectronics industry. This datasheet provides information on composition, physical properties, microstructure, hardness, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, and joining. Filing Code: In-2. Producer or source: Indium Corporation of America.

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