INDALLOY No. 7 is a solder (50% indium-50% lead) that drastically reduces gold scavenging when used to solder components to gold-coated substrates in place of conventional (63% tin-37% lead) solder. Thus it has had obvious applications in the hybrid microelectronics industry. This datasheet provides information on composition, physical properties, microstructure, hardness, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, and joining. Filing Code: In-2. Producer or source: Indium Corporation of America.

chemical composition, corrosion-resistant alloys, hardness, heat treatability, hybrid microelectronics applications, INDALLOY No. 7, joinability, microstructure, physical properties, solder components, tensile properties, workability
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Copyright © ASM International® 1996
1996
ASM International
Topics
Microstructure Electrical and electronics Corrosion-resistant alloys Chemical composition Heat treatability Joinability Workability Hardness Tensile properties Physical properties Thermal properties Indium
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