International Symposium for Testing and Failure Analysis

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The International Symposium for Testing and Failure Analysis is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques.

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The Potential of Inline Automated Defect Review of Mechanical Property and Electrical Characterization by AFM

Introduction of a Novel Sample Preparation Technique for the Failure Analysis of Silicon Integrated Photonics Modules

Robust Test Method of TSOP PEMs for Space Application

X-Ray Computed Tomography: A Potentially Destructive “Non-Destructive Evaluation” Technique

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